Hynix 现代

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The 21st Century is rapidly becoming the era of digital technology, an era based on Internet and information communication. The significance of the Semiconductor industry is more pronounced than at any time in the past. The industrial development in the 19th century was based on the steam engine, which was developed into the railways. In the 20th Century electricity and telecommunications changed the way we lived. Our society in the 21st century is a digital age that will be driven by the semiconductor.

Hynix Semiconductor has grown steadily into a world-class Semiconductor manufacturer. Our success has been based on a number of factors such as efficiency of production, ongoing R & D investment, a clear and dedicated management team whose primary concern is customer satisfaction and a now with a exclusive focus on semiconductors.

In 1999 we merged with LG Semiconductor, with the result that Hynix Semiconductor is now the world's largest DRAM producer, as well as being the leader in semiconductor R & D by fully exploiting the synergies resulting from the integration of both companies.

Our company has greatly improved its competitiveness and price advantage through its restructuring efforts. We are in the process of spinning-off non-semiconductor affiliates.

Hynix as a leader in this 21st Century digital era is committed to contributing to improvements and prosperity for all to enjoy who live in this digital world. For our shareholders our aim is ongoing value creation within Hynix Semiconductor with improved, sustained profitability, corporate governance and for our customers the best products and prices allied with excellent service and response.

1983. 02 Founded Hyundai Electronics Industries Co., Ltd.

1984. 09 Completed FAB II-A

1985. 10 Started the mass production of the 256k DRAM

1986. 04 Established the Semiconductor research Institute established

1986. 06 Held the first workers cultural fair "Ami Carnival" held

1988. 01 Developed the 1M DRAM

1988. 11 Established Local Corporation in Europe (HEE)

1989. 09 Developed the 4M DRAM

1989. 11 Competed FAB III

1991. 10 Developed the 16DRAM

1992. 11 Developed the 64M DRAM

1993. 10 Took over the Maxtor (U.S HDD producing company)

1993. 09 Acquired ISO 9001 certification on semiconductor category

1995. 10 Established semiconductor factory in Oregon, U.S

1995. 10 Developed the 256M SDRAM firstly in the world

1996. 12 Opened the company to public subscription and listed stocks

1997. 05 Developed the 1G synchronous Dram firstly in the world synchronous DRAM

1998. 09 Developed the 64M DDR Synchronous DRAM

1999. 03 Sold the specialized semiconductor assembling company (ChipPAC)

1999. 10 Merged the LG semiconductor Co., Ltd. into our company

2000. 04 'Hyundai Autonet' was spun-off from Electro Circuit Division

2000. 08 'Hyundai Image Quest' was spun-off from Monitor Sales Division

2001. 03 Changed the company name to "Hynix Semiconductor Inc."

2001. 05 'Hyundai CuriTel' was spun-off from Communication Service Division

 

DRAM

With its large DRAM wafer production capacity, ceaseless technological innovation, and pursuit of the highest in quality, Hynix is now leading industry efforts to develop and manufacture DDR, Rambus and ultra-high speed DRAM. Steady R&D investment and leading technology has given Hynix a head start in the development of these high-speed memory semiconductors, which are poised to challenge Giga and Tera bit memory semiconductors, the so-called "dream semiconductors".

Hynix is one of the leaders in developing ADT (Advanced DRAM Technology), the next generation in DRAM technology. Currently, Hynix offers a full range of products from 4M to 512M sync, EDO to DDR and Rambus, and from memory modules for Desktop PCs to low-power/miniaturized memory products for digital consumers. Hynix also offers memory modules for high-end servers. Through its global manufacturing network Hynix is securing a position as a well-respected DRAM supplier to customers worldwide.

Hynix's strategy of advanced entry into the DDR market means that it now boasts the highest market share in the graphic area present. It was the first to develop the 512M DDR for mass production, and it also has received recognition for the excellent standard of its DDR product from major DDR chipset suppliers. However the Company is never satisfied or complacent about its position. Hynix will continue to develop new products and new technologies required in the 21st century.

 

SRAM

Following the development and full-scale marketing of a product line-up of 1.8V-3V SRAM from 1M to 8M targeting Mobile Phone applications, the Hynix's SRAM business went from achieving a 200% growth rate in 1999, to achieving more than 300% growth rate in the year 2000. As a result, SRAM revenue improvement made up 7% of total semiconductor revenue in 2000. There are a number of key factors behind these successful results. Adequate investment in R&D, secured a dedicated SRAM dedicated product on line, rapid growth in the mobile communications market, and stable demand through long-term supply contracts with major mobile phone manufacturers resulted in a significant growth in sales.

At present, Hynix offers a full range of SRAMs from 1M to 8M, and expects to reduce manufacturing costs by migrating from a 0.25um to 0.18um process. In respond to demands for high-density memory for the next generation mobile communications technology, the Company is developing Pseudo SRAM based on DRAM technology, an area where Hynix is taking the lead. Through continued technological innovation, pursuit of higher qualification, and concerted cost-reduction efforts Hynix will continue to satisfy its customers and secure a respected position in the world SRAM market.

 

FLASH MEMORY

The Flash memory market has grown dramatically in the past few years as the number of applications and the usage per application has expanded. According to industry analysts, the market doubled to more than USD 10 billion during 2000 and the market is expected to show continued growth for the next several years.

Headquartered in San Jose, California, and with design, technology and product/test engineering teams in the USA and Korea, Hynix's Flash Business Unit designs, manufactures and markets Flash memory solutions for high-volume applications. These applications include cellular phones, DVD players, personal computers, set-top boxes, Personal Digital Assistants(PDA), hard disk drives, modems and a variety of telecommunications and networking equipment. Current product offerings from Hynix include operating voltage ranges of 4.5-5.5 volts, 2.7-3.6 volts and 1.8-2.2 volts and densities from 2-32M. All products are compatible with AMD and manufactured at Hynix's world-class DRAM fabrication facilities in Korea, enabling rapid adjustments in capacity to meet its customers' volume product needs. Hynix's Flash memory is fully compliant with the JEDEC Standard for single-supply Flash memory.

Hynix began manufacturing Flash memory in 1999, and sales grew to more than USD 110 million in 2000. The Company's Flash memory technology roadmap plans a migration from 0.25um in 2000 to 0.18um in 2001 and 0.13um in 2002. These developments will help the Company achieve steady, high revenue growth, cost reduction, and consequently maximum profitability.

 

Hynix successfully established a foothold in the sector, posting as high a growth rate as 170% a year in sales. In 2000, the Company focused on the non-memory business as part of its policy to develop a well-balanced business portfolio.

Success was a result of concentrating on the Company's core abilities and foundry, one of its strongest points, as well as on three major application products (LCD Driver IC, MCU and CMOS Image Sensor). Synergy effects from merger and integration, timely development of sophisticated new products, and success in attracting large-scale customers also contributed to the success. The Company will continue to strengthen its position as a pure semiconductor business player by building a portfolio of memory and non-memory products.

 

SMS(Foundry) Business

Hynix plants to strategically foster the Foundry business and maintain a high growth rate in the new year by promptly switching over some memory-producing chip facilities to mass-producing non-memory chips with a capacity of 8 inch equivalent 82,000 wafers per month. The Company also seeks higher start volume in the Foundry business through the embedded memory (DRAM, SRAM, Flash, FeRAM) on a mid-to-long-term basis.

In the New Year, the Company started volume production of 0.25um foundry products, new core products, having already secured bulk-purchase customers.

 

Standard Product Business

In the System IC sector, Hynix expects to enjoy rapid growth by focusing on increased profitability and added value for three major strategic items (LCD Driver IC, MCU and CMOS Image Sensor).

Hynix achieved a 350% increase in 2000 for sales of LCD driver IC through securing TFT-LCD manufacturers as clients. Hynix expects to become a leader in this sector through is development of micro color STN LCD driver ICs for cellular phones. PDA, and DSC, which are expected to show a continued increase in demand in the future. The Company also plans to selectively develop several major products including CMOS, RF and digital media applications, as it anticipates they will become future major sources of revenue in the era of digital home appliances, information and telecommunications.

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