|
Shuttle
浩鑫
内存条
| Model
| Key Features
|
| PC133 Unbuffered DRAM
|
- 168 edge connector pads
- Clock frequency: 133 MHz
- JEDEC standard
- LVTTL interface
.3 Voltage +-0.3V
- Serial Presence Detect support
- MRS cycle with address key programs
-CAS latency: 2,3 (clock)
-Burst length: 1,2,4,8 & full page
-Burst type: Sequential & Interleave
- 2 variations of refresh
-Auto Refresh
-Self refresh
|
| Rambus RIMM
|
- 184 edge connector pads
- Clock frequency: 600/711/800 MHz (RSL)
- Separate Row & Column bus for higher efficiency
- RSL & CMOS interface
Single power supply of 2.5 Voltage+-0.125V
- Low power and power down self refresh modes
- Separate Row & Column bus for higher efficiency
- Serial Presence Detect Support
|
| PC100 SO-DIMM
|
- 144 edge connector pads
- Clock frequency: 100 MHz
- JEDEC standard
3.3 Voltage +-0.3V
- Serial Presence Detect support
- MRS cycle with address key programs
-CAS latency: 2,3 (clock)
-Burst length: 1,2,4,8 & full page
-Burst type: Sequential & Interleave
- 2 variations of refresh
-Auto Refresh
-Self refresh
|
| DDR Unbuffered DIMM
|
- 184 edge connector pads
- Double Data Rate architecture
- Clock frequency: 100/133 MHz
- Data Rate: 200/266 MHz
- JEDEC standard
- 2 Banks to be operated simultaneously or independently
- SSTL-2 interface
2.5 Voltage+-0.2V
- MRS cycle with address key programs
-CAS latency: 2,2.5 (clock)
-Burst length: 2,4,8
-Burst type: Sequential & Interleave
- Serial Presence Detect support
- 2 variations of refresh
-Auto Refresh
-Self refresh
|
|
Capacity
|
Chip
Configuration
|
Chip
Type
|
CAS
Latency
|
|
64MB
|
168 Pins DIMM 3.3V with SPD
for PC133
|
|
|
8M x 64
|
4M x 16 (x8)
|
SDRAM
|
CL2,3
|
|
8M x 64
|
8M x 8 (x8)
|
SDRAM
|
CL2,3
|
|
64MB
|
168 Pins DIMM 3.3V with ECC & SPD
For PC133
|
|
|
8M x 72
|
8M x 8 (x9)
|
SDRAM
|
CL2,3
|
|
128MB
|
168 Pins DIMM 3.3V with SPD
for PC133
|
|
|
16M x 64
|
8M x 8 (x16)
|
SDRAM
|
CL2,3
|
|
16M x 64
|
16M x 8 (x8)
|
SDRAM
|
CL2,3
|
|
128MB
|
168 Pins DIMM 3.3V with ECC & SPD
For PC133
|
|
|
16M x 72
|
8M x 8 (x18)
|
SDRAM
|
CL2,3
|
|
16M x 72
|
16M x 8 (x9)
|
SDRAM
|
CL2,3
|
|
256MB
|
168 Pins DIMM 3.3V with SPD for PC133
|
|
|
32M x 64
|
16M x 8 (x16)
|
SDRAM
|
CL2,3
|
|
256MB
|
168 Pins DIMM 3.3V with ECC & SPD
For PC133
|
|
|
32M x 72
|
16M x 8 (x18)
|
SDRAM
|
CL2,3
|
|
512MB
|
168 Pins DIMM 3.3V with SPD for PC133
|
|
|
64M x 64
|
32M x 8 (x16)
|
SDRAM
|
CL2,3
|
|
512MB
|
168 Pins DIMM 3.3V with ECC & SPD
For PC133
|
|
|
64M x 72
|
32M x 8 (x18)
|
SDRAM
|
CL2,3
|
|
Capacity
|
Chip
Configuration
|
Chip
Type
|
|
144MB
|
184Pins RIMM 2.5V with ECC
|
|
|
|
8M x 18 (x 8)
|
RDRAM
|
|
288MB
|
184Pins RIMM 2.5V with
ECC
|
|
|
|
8M x 18 (x 16)
|
RDRAM
|
|
Capacity
|
Chip
Configuration
|
Chip
Type
|
CAS
Latency
|
|
64MB
|
144 Pins DIMM 3.3V with SPD
For PC100
|
|
|
8M x 64
|
4M x 16 (x8)
|
SDRAM
|
CL2,3
|
|
8M x 64
|
8M x 8 (x8)
|
SDRAM
|
CL2,3
|
|
8M x 64
|
8M x 16 (x4)
|
SDRAM
|
CL2,3
|
|
128MB
|
168 Pins DIMM 3.3V with SPD For PC100
|
|
|
16M x 64
|
8M x 16 (x8)
|
SDRAM
|
CL2,3
|
|
16M x 64
|
8M x8 (x8)
|
SDRAM
|
CL2,3
|
|
256MB
|
168 Pins DIMM 3.3V with SPD
For PC100
|
|
|
32M x 64
|
32M x 8 (x8)
|
SDRAM
|
CL2,3
|
|
Capacity
|
Chip
Configuration
|
Chip
Type
|
CAS
Latency
|
|
128MB
|
184 Pins DIMM 2.5V for
DDR-266
|
|
|
16M x 64
|
8M x 8 (x16)
|
DDR SDRAM
|
CL2,2.5
|
|
16M x 64
|
16M x 8 (x8)
|
DDR SDRAM
|
CL2,2.5
|
|
128MB
|
184 Pins DIMM 2.5V with ECC for DDR-266
|
|
|
16M x 72
|
8M x 8 (x18)
|
DDR SDRAM
|
CL2,2.5
|
|
16M x 72
|
16M x 8 (x9)
|
DDR SDRAM
|
CL2,2.5
|
|
256MB
|
184 Pins DIMM 2.5V for DDR-266
|
|
|
32M x 64
|
16M x 8 (x16)
|
DDR SDRAM
|
CL2,2.5
|
|
32M x 64
|
32M x 8 (x8)
|
DDR SDRAM
|
CL2,2.5
|
|
256MB
|
184 Pins DIMM 2.5V with ECC for DDR-266
|
|
|
32M x 72
|
16M x 8 (x18)
|
DDR SDRAM
|
CL2,2.5
|
|
32M x 72
|
32M x 8 (x9)
|
DDR SDRAM
|
CL2,2.5
|
感谢 Shuttle
浩鑫
提供资料
|
