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C3
![C3_cr_L[1].gif (7354 字节)](../image/C3_cr_L1.gif)
- Cool Processing
- The coolest running processor on the market
- Cool Technology
- The first processor in the world to be manufactured using leading edge
0.13 and 0.15 micron manufacturing processes, the VIA C3™ has the
world's smallest x86 processor die size. This not only minimizes power
consumption and heat dissipation, but also guarantees rock-solid reliability
in even the most demanding environments.
- Cool Performance
- A rich computing and online experience
- Cool Innovation
-Enabling the creation of new generation of energy efficient Desktop PCs,
Mobile PCs, High Density Servers, and Digital PC appliances
- Cool Value
- Industry benchmark for affordable Internet computing
  
Introduction
The first processor on the market to be built
using a leading edge 0.15 micron manufacturing process, the new VIA C3 processor
sets the new de facto standard for affordable low power, high-performance x86
processors. Integrating a total of 192KB full-speed cache on the world's
smallest x86 processor die measuring only 52mm2, it combines robust Internet and
mainstream software application performance with exceptionally low power
consumption and heat dissipation properties.
The VIA C3 processor is available at speeds
starting from 733MHz and 750MHz and 128KB of full speed Level 1 cache and 64KB
of full speed level 2 cache. Support for highe speed 100/133MHz Front Side Bus
as well as MMX and 3DNOW ! multimedia instruction sets further boosts the
processor's performance.
The VIA C3 processor is fully plug-in compatible with industry-standard Socket
370 motherboards from the world's leading mainboard vendors, and runs a complete
range of Microsoft® Windows® and other popular x86 operating systems and
software programs, as well as all the latest interenet plug-ins and
applications.
When coupled with one of VIA's growing range
of integrated core logic chipsets such as the VIA
Apollo PLE133, ProSavage™
PM133, or the ProSavage™
Twister, the processor also provides a highly flexible and cost effective
standardized platform that OEMs and system integrators can utilize across
multiple Value PC, Information
PC, and Value
Internet Architecture product lines.
The table below outlines the features and benefits of the VIA C3:
| Feature |
Benefits |
| Clock
Speeds up to 866MHz |
Robust
performance for the Internet and all the latest business, personal
productivity, educational, and entertainment applications. |
| Industry
leading 0.13 and 0.15 micron manufacturing processes |
Enables
cool processing by minimizing power consumption and heat dissipation while
maximizing processor speed. |
| 100/133MHz
Front Side Bus |
Ensures efficient
transfer of data between processor core and system memory, enabling fast
system performance.
|
128KB
L1 and 64KB L2 Cache
|
Enhances
responsiveness by delivering instant access to data used most often.
|
| Socket
370 pinout |
Plug-in compatible
with a complete range of Socket 370 motherboards and notebooks.
|
| 3DNow!™
and MMX™ Technology |
Advanced
multimedia capabilities for 3D graphics and video applications. |
| Low
Heat Dissipation |
Ideal
for a full range of desktop and mobile solutions including fanless and
enclosed designs. |
| Choice
of PGA (Pin Grid Array), Micro PGA, and Enhanced BGA packages |
Flexible
solutions for a complete range of desktop, mobile, server, and Digital PC
appliance applications. |
| Ultra
Low Power Consumption |
Saves
energy costs and maximizes notebook battery life. |
C3 E 系列
- Cool Processing
- The coolest running processor solution in an EBGA package
- Cool Technology
- The world's smallest x86 processor die size of 52mm²
- Cool Performance
- A rich multimedia and Internet experience across a complete range of x86
computing and embedded Operating Systems and applications
- Cool Innovation
- Enabling a broad spectrum of exciting new computing, communications,
multimedia, and embedded devices
- Cool Value
- New benchmark for affordability
 
| Feature |
Benefits |
| Enhanced
BGA Package |
Highly
cost-effective and low heat solution that reduces time to market and
enhances reliability. |
| World's
smallest x86 processor die size |
Ultra
low power consumption and highly-efficient heat dissipation. |
| LongHaul™
Technology |
Reduces
power consumption to less than one watt by allowing the processor to run
at different frequencies and voltages. |
| Clock
Speeds up to 733MHz |
Robust
performance for the Internet and all the latest business, personal
productivity, educational, and entertainment applications. |
Up
to 192KB full speed Level 1 and Level 2 cache
|
Enhances
responsiveness by delivering instant access to data used most often.
|
| 3DNow!™
and MMX™ Technology |
Advanced
multimedia capabilities for 3D graphics and video applications. |
| Full
x86 Operating System & software application compatibility |
Leverages
the richest and most cost-effective software development platforms,
including Microsoft® Windows® and Linux. |
 
Mobile VIA C3™
Processor
The mobile VIA C3™
processor is shipping now at speeds up to 800MHz; pricing information is
available on request. Certain versions also come with VIA LongHaul™
power management technology, which can reduce the processor's voltage and clock
speed to maximize battery life. Other features include 128KB Level 1 and 64KB
Level 2 full speed cache, as well as support for a 100/133MHz Front Side Bus and
MMX™ and 3DNow! multimedia instructions, to ensure robust
levels of performance for all the most popular mainstream software and Internet
applications.
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